The leaked Pixel 9, 9 Pro, and 9 Pro XL have now undergone initial testing, while we have details on the Tensor G4.
According to benchmark test results Rosetted, the Tensor G4 has a 1+3+4 core configuration with Cortex-X4 acting as core/flagship. This is followed by three medium Cortex-A720 cores and four small Cortex-A520 cores.
The original Tensor and G2 had a 2+2+4 base configuration, while the G3 switched to 1+4+4. Here is a historical comparison:
| Tensor | Tensor G2 | Tensor G3 | Tensor G4 |
| 2x Cortex-X1 (2.8GHz) | 2x Cortex-X1 (2.85 GHz) | 1x Cortex-X3 (2.91 GHz) | 1x Cortex-X4 (3.1 GHz) |
| 2x Cortex-A76 (2.25 GHz) | 2x Cortex-A78 (2.35 GHz) | 4x Cortex-A715 (2.37 GHz) | 3x Cortex-A720 (2.6 GHz) |
| 4x Cortex-A55 (1.8GHz) | 4x Cortex-A55 (1.8GHz) | 4x Cortex-A510 (1.7 GHz) | 4x Cortex-A520 (1.95 GHz) |
With Cortex-X4 (using Snapdragon 8 Gen 3), He scores 15% performance improvement and 40% better energy efficiency compared to the previous generation.
On the A720 frontcompared to its predecessor, there is a 20% increase in energy efficiency, while the A510 achieves a similar 22% gain.
These devices don’t run the latest firmware and have months of optimization and tweaking ahead of them. You should keep this in mind when looking at the AnTuTu benchmarks for the Tensor G4 in the Pixel 9 series. By comparison, there are some performance boosts, including the Pixel 8.
- Pixel 8: 877,443 points
- Pixel 9 (Tokai): 1,016,167
- Pixel 9 Pro (Cayman): 1,148,452
- Pixel 9 Pro XL (Komodo): 1,176,410
The Tensor G5 in the Pixel 10 is expected to make its way to TSMC, while the Pixel 9 and Samsung-made chip could be a significant asterisk for buyers this year. Previous leaks have suggested that the Tensor G4 will use Samsung’s latest 4nm process and packaging method. FOWLP (Fan-out Wafer Level Packaging) is said to continue to improve thermal management and energy efficiency.
FTC: We use automatic affiliate links that generate income. More.