Sony recently gently updated the PS5 console with a new variant known as the CFI-1202 that offers lower temps and power input. The new console is lighter, runs cooler and consumes less power, all thanks to the updated AMD Obreon Plus SOC, which welcomes the TSMC 6nm process node.
Sony’s PS5 “CFI-1202” Console Variant Features Improved 6nm AMD Oberon Plus SOC: Reduced Size, Lower Power and Cooler Operation
One final disassembly video posted by Austin Evans, Techtuber noted that the Sony PS5 console is shipping in a new variant that is lighter, cooler and consumes less power. This new PS5 variant is labeled “CFI-1202” and we can now understand why it is so much better than Sony’s original PS5 variants (CFI-1000 / CFI-1001).
technical output, Angstronomy, confirmed in their exclusive that the Sony PS5 (CFI-1202) comes with an upgraded AMD Oberon SOC known as Oberon Plus, which uses the TSMC N6 process (6nm). TSMC has made it so that their 7nm (N7) process node has the same design pattern as their 6nm EUV (N6) node. This allows TSMC partners to easily migrate existing 7nm chips to the 6nm node without major challenges. The N6 process node offers an 18.8% increase in transistor density and also reduces power consumption and in turn lowers temperature.
Therefore, the new Sony PS5 consoles are lighter and have a smaller cooler compared to the release variants. But that’s not all, we can also see a new chip shot of the AMD Oberon Plus SOC sitting next to the 7nm Oberon SOC. The new die measures approximately 260mm2, which represents a 15% reduction in die size compared to the 7nm Oberon SOC (~300mm2). There is another advantage to moving to 6nm, and that is the number of chips that can be produced on a single wafer. The release states that each Oberon Plus SOC wafer can produce about 20% more chips for the same price.
What this means is that Sony can offer more Oberon Plus chips for use in the PS5 without affecting their cost, further mitigating the shortcomings that current-gen consoles have faced since their launch. It is also reported that TSMC will be phasing out its 7nm Oberon SOCs in the future and moving entirely to the 6nm Oberon Plus SOC, resulting in 50% more chips per wafer. Microsoft is expected to use the 6nm process node for the updated Arden SOC for Xbox Series X consoles in the future.
News source: Angstronomy
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